According to a new report by Intel Market Research, the global Package Substrates Market is witnessing strong growth driven by the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), 5G infrastructure, and advanced semiconductor packaging technologies. According to the latest market research report by Intel Market Research, the market was valued at USD 12,182 million in 2025 and is projected to reach USD 22,191 million by 2034, growing at a CAGR of 8.7% during the forecast period.
Package substrates play a critical role in semiconductor packaging by providing electrical interconnections, thermal management, power distribution, and mechanical support between semiconductor chips and printed circuit boards (PCBs). Increasing adoption of chiplet architectures, heterogeneous integration, and high-density packaging solutions is significantly boosting demand for advanced substrate technologies such as FCBGA, FCCSP, and ABF substrates.
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